Invention Grant
- Patent Title: Hot melt moisture cure adhesive compositions
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Application No.: US14336405Application Date: 2014-07-21
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Publication No.: US09605187B2Publication Date: 2017-03-28
- Inventor: Marietta B. Helmeke , Jeffery G. Schmierer , Theresa Unze-Schmierer
- Applicant: H.B. FULLER COMPANY
- Applicant Address: US MN St. Paul
- Assignee: H.B. Fuller Company
- Current Assignee: H.B. Fuller Company
- Current Assignee Address: US MN St. Paul
- Agent Kirsten Stone; Kristi Halloran
- Main IPC: C09J125/04
- IPC: C09J125/04 ; B32B7/12 ; E06B5/16 ; C08G18/12 ; C09J175/04

Abstract:
An adhesive composition that includes: one or more polyester polyether copolymers of formula I: wherein Nu is a predominately cyclic nucleus and RI is randomly selected from either a C2-6 alkylene or an amorphous, long-chain polyether subunit including a polyoxyalkylene group; one or more polyisocyanate prepolymers that includes the reaction product of: one or more polyols; and a polyfunctional isocyanate having a functionality of more than about 2; polymeric MDI; and a first aromatic or aromatic-aliphatic polymer tackifying resin having a softening point of equal to or greater than about 100° C.
Public/Granted literature
- US20140329097A1 HOT MELT MOISTURE CURE ADHESIVE COMPOSITIONS Public/Granted day:2014-11-06
Information query
IPC分类: