Invention Grant
- Patent Title: Rivet nut unit and mounting method thereof
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Application No.: US14578624Application Date: 2014-12-22
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Publication No.: US09605706B2Publication Date: 2017-03-28
- Inventor: Seokhwan Hwang , Mun Yong Lee
- Applicant: SUNGWOO HITECH CO., LTD.
- Applicant Address: KR Busan
- Assignee: SUNGWOO HITECH CO., LTD.
- Current Assignee: SUNGWOO HITECH CO., LTD.
- Current Assignee Address: KR Busan
- Agency: Lex IP Meister, PLLC
- Priority: KR10-2014-0054345 20140507; KR10-2014-0128439 20140925
- Main IPC: F16B37/04
- IPC: F16B37/04 ; F16B37/06 ; F16B33/00

Abstract:
A rivet nut unit is disclosed. An exemplary embodiment of the present invention provides a rivet nut unit bonding at least one plate by being riveted to the plate and fastened with a bolt that may include: a head portion supported on an upper surface of the plate at a position corresponding to a processed hole in the plate, and formed with a penetration hole in the middle thereof corresponding to the hole; and an insertion portion extended from one side of the head portion, inserted into the hole, and formed with at least one slot and a protruding end bent to a lower surface of the plate for coupling the head portion to the plate while riveting the plate.
Public/Granted literature
- US20150322992A1 RIVET NUT UNIT AND MOUNTING METHOD THEREOF Public/Granted day:2015-11-12
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