Invention Grant
- Patent Title: LED module with mounting pads
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Application No.: US14690188Application Date: 2015-04-17
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Publication No.: US09605842B1Publication Date: 2017-03-28
- Inventor: Jared Michael Davis
- Applicant: Cooper Technologies Company
- Applicant Address: US GA Peachtree City
- Assignee: COOPER LIGHTING, LLC
- Current Assignee: COOPER LIGHTING, LLC
- Current Assignee Address: US GA Peachtree City
- Agency: King & Spalding LLP
- Main IPC: F21V15/00
- IPC: F21V15/00 ; F21V29/70 ; F21V7/00 ; F21V21/14 ; F21S8/02 ; F21Y101/02

Abstract:
A light module includes a heat sink and one or more light sources coupled within a heat sink cavity formed therein. The heat sink includes an internal surface surrounding the cavity. The internal surface includes a mounting region, a reflector region extending from the perimeter of the mounting region to a distal end, and a decorative region extending from the distal end to a second distal end. The light module includes multiple mounting pads coupled circumferentially around a portion of the heat sink. The mounting pads are configured to facilitate the heat sink being coupled within different housing diameter sizes. The light module includes a trim ring integrally formed with the heat sink and extending radially outward from one end of the heat sink.
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