Invention Grant
- Patent Title: Photosensitive resin composition and application thereof
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Application No.: US15231771Application Date: 2016-08-08
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Publication No.: US09606436B2Publication Date: 2017-03-28
- Inventor: Yu-Jie Tsai , I-Kuang Chen
- Applicant: CHI MEI CORPORATION
- Applicant Address: TW Tainan
- Assignee: CHI MEI CORPORATION
- Current Assignee: CHI MEI CORPORATION
- Current Assignee Address: TW Tainan
- Agency: CKC & Partners Co., Ltd.
- Priority: TW104127031A 20150819
- Main IPC: G03F7/029
- IPC: G03F7/029 ; G03F7/033 ; G03F7/075 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/40

Abstract:
A photosensitive resin composition includes an alkali-soluble resin (A), a compound having an unsaturated vinyl group (B), a photo initiator (C), solvent (D) and a silane compound (E) having a structure shown as formula (I): in the formula (I), A individually and independently represents a single bond, an alkylene group, or an arylene group, B individually and independently represents an organic group having diphenyl phosphine, hydrogen atom, an alkyl group, an aryl group, or —OR, in which R is a C1-C6 alkyl group or a phenyl group, at least one B is the organic group having diphenyl phosphine and at least one B is —OR. When B is —OR, A connected to B is the single bond. A film formed by the photosensitive resin composition has good refractivity and adhesivity to molybdenum.
Public/Granted literature
- US20170052446A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF Public/Granted day:2017-02-23
Information query
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