Invention Grant
- Patent Title: Insulator module having structure enclosing atomspheric pressure gas
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Application No.: US13662030Application Date: 2012-10-26
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Publication No.: US09606587B2Publication Date: 2017-03-28
- Inventor: William Hamburgen
- Applicant: Google Inc.
- Applicant Address: US CA Mountain View
- Assignee: Google Inc.
- Current Assignee: Google Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Brake Hughes Bellermann LLP
- Main IPC: G06F1/20
- IPC: G06F1/20

Abstract:
A device including a heat-absorbing component, and one or more heat-generating components. At least one heat-generating component is located in proximity to an inner surface of the heat-absorbing component, and a gap exists between the at least one heat-generating component and the inner surface of the heat-absorbing component. The device further including an insulator, located in the gap, including an insulator structure enclosing atmospheric pressure gas, where the atmospheric pressure gas has a thermal conductivity lower than air.
Public/Granted literature
- US20140118927A1 INSULATOR MODULE HAVING STRUCTURE ENCLOSING ATOMSPHERIC PRESSURE GAS Public/Granted day:2014-05-01
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