According to one embodiment, an insulated wire is disclosed. The wire includes a conductor and an insulating film formed on the conductor, the insulating film including a first layer of a first polyamideimide containing an adhesion improver; a second layer of a second polyamideimide obtained by reacting an isocyanate component containing 10 to 70 mol % in total of 2,4′-diphenylmethane diisocyanate and dimer acid diisocyanate with an acid component; and a third layer of a polyimide obtained by reacting an acid component containing 50 to 80 mol % of 3,3′,4,4′-biphenyl tetracarboxylic dianhydride and 20 to 50 mol % of pyromellitic anhydride with a diamine component containing 4,4′-diaminodiphenyl ether.