Invention Grant
- Patent Title: Heat treatment apparatus and heat treatment method for heating substrate by irradiating substrate with flash of light
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Application No.: US14142991Application Date: 2013-12-30
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Publication No.: US09607870B2Publication Date: 2017-03-28
- Inventor: Hiroki Kiyama
- Applicant: DAINIPPON SCREEN MFG. CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP2013-010836 20130124
- Main IPC: F26B3/30
- IPC: F26B3/30 ; A45D20/40 ; H01L21/67 ; H01L21/324

Abstract:
A flash heating part in a heat treatment apparatus includes 30 built-in flash lamps, and irradiates a semiconductor wafer held by a holder in a chamber with a flash of light. Thirty switching elements are provided in a one-to-one correspondence with the 30 flash lamps. Each of the switching elements defines the waveform of current flowing through a corresponding one of the flash lamps by intermittently supplying electrical charge thereto. Radiation thermometers measure an in-plane temperature distribution of the semiconductor wafer during flash irradiation. Based on the results of measurement with the radiation thermometers, a controller individually controls the operations of the 30 switching elements to individually define the light emission patterns of the 30 flash lamps.
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Information query
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