Invention Grant
- Patent Title: Adhesive composition, laminate, and stripping method
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Application No.: US14691262Application Date: 2015-04-20
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Publication No.: US09607875B2Publication Date: 2017-03-28
- Inventor: Takahiro Yoshioka , Koki Tamura , Hirofumi Imai , Atsushi Kubo , Yasumasa Iwata , Shingo Ishida
- Applicant: Tokyo Ohka Kogyo Co., Ltd.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2014-088539 20140422; JP2015-039457 20150227
- Main IPC: C09J125/06
- IPC: C09J125/06 ; C09J153/00 ; B32B7/12 ; B32B38/00 ; H01L21/683 ; C09J145/00 ; B32B7/06 ; B32B9/00 ; B32B9/04 ; B32B27/16 ; B32B27/20 ; B32B27/22 ; B32B27/28 ; B32B27/30 ; C09J153/02
Abstract:
An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.
Public/Granted literature
- US20150299534A1 ADHESIVE COMPOSITION, LAMINATE, AND STRIPPING METHOD Public/Granted day:2015-10-22
Information query
IPC分类:
