Invention Grant
- Patent Title: Use of repellent material to protect fabrication regions in semi conductor assembly
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Application No.: US14146101Application Date: 2014-01-02
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Publication No.: US09607896B2Publication Date: 2017-03-28
- Inventor: Raj Peddi , Jeffrey Gasa , Kenji Kuriyama , Hoseung Yoo
- Applicant: HENKEL IP & HOLDING GMBH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent James J. Cummings
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L23/00
Abstract:
A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.
Public/Granted literature
- US20140113435A1 USE OF REPELLENT MATERIAL TO PROTECT FABRICATION REGIONS IN SEMI CONDUCTOR ASSEMBLY Public/Granted day:2014-04-24
Information query
IPC分类:
