A system for programming integrated circuit (IC) dies formed on a wafer includes an optical transmitter that outputs a digital test program as an optical signal. At least one optical sensor (e.g., photodiode) is formed with the IC dies on the wafer. The optical sensor detects and receives the optical signal. A processor formed on the wafer converts the optical signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The optical transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the optical signal so that all of the IC dies are concurrently programmed with the digital test program.