Invention Grant
- Patent Title: Semiconductor device for verifying operation of through silicon vias
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Application No.: US14487903Application Date: 2014-09-16
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Publication No.: US09607925B2Publication Date: 2017-03-28
- Inventor: Tae-Sik Yun , Kang-Seol Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2014-0044776 20140415
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L23/48 ; G01R31/3185 ; H01L21/66
Abstract:
A semiconductor device may include: a plurality of output paths, which include a plurality of through silicon vias (TSVs), respectively, and suitable for transmission of test confirmation information; an information provider suitable for providing the test confirmation information to the plurality of TSVs; and an output controller suitable for selectively blocking one of the output paths including a failed one among the plurality of TSVs.
Public/Granted literature
- US20150293168A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-10-15
Information query
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