There is provided a package substrate including: a body unit including a plurality of base substrates and having a mounting region allowing at least one semiconductor device to be mounted thereon; and a plurality of magnetic field shielding units including a ferromagnetic material and provided within the body unit, wherein the plurality of magnetic field shielding units may be respectively disposed on the plurality of different base substrates such that a magnetic field shielding region defined by the plurality of magnetic field shielding units corresponds to the mounting region.