Invention Grant
- Patent Title: Chip package
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Application No.: US13958794Application Date: 2013-08-05
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Publication No.: US09607951B2Publication Date: 2017-03-28
- Inventor: Uming Ko , Tzu-Hung Lin , Tai-Yu Chen
- Applicant: MediaTek Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: MEDIATEK SINGAPORE PTE. LTD.
- Current Assignee: MEDIATEK SINGAPORE PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/495 ; H01L23/02 ; H01L23/04 ; H01L23/34 ; H01L23/00 ; H01L23/16
Abstract:
According to an embodiment of the present invention, a chip package is provided. The chip package includes a substrate. A chip is disposed on the substrate. A stiffener is disposed on the substrate. The thermal conductivity of the stiffener is higher than the thermal conductivity of the substrate.
Public/Granted literature
- US20150035131A1 CHIP PACKAGE Public/Granted day:2015-02-05
Information query
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