Object is to prevent a coupling failure between a rewiring and a coupling member for coupling to outside. A passivation film and a first polyimide film are formed so as to cover a wiring layer. A first opening portion is formed in the first polyimide film. A rewiring is formed on the first polyimide film so as to be coupled to the wiring layer via the first opening portion. A second polyimide film that covers the rewiring and has a second opening portion communicated with the rewiring is formed. A palladium film is formed as a barrier film by sputtering on a portion of the surface of the rewiring at which the second opening portion exists. A solder ball is coupled to the palladium film.