Invention Grant
- Patent Title: Metal line with increased inter-metal breakdown voltage
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Application No.: US14848081Application Date: 2015-09-08
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Publication No.: US09607997B1Publication Date: 2017-03-28
- Inventor: Katsuo Yamada , Yuji Takahashi , Noritaka Fukuo , Masami Uozaki , Kiyokazu Shishido , Takuya Futase , Shunsuke Watanabe
- Applicant: SanDisk Technologies Inc.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES INC.
- Current Assignee: SANDISK TECHNOLOGIES INC.
- Current Assignee Address: US TX Plano
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L27/112 ; H01L21/768 ; H01L23/528 ; H01L23/522
Abstract:
A wide trench having a width W1 and narrow trenches having a width W2 that is less than W1 are formed in a dielectric layer, the wide trench extending deeper in outer regions than in a central region. A trench modification step changes the width of the wide trench and reduces a depth difference between the outer regions and the central region of the wide trench.
Public/Granted literature
- US20170069638A1 Metal Line with Increased Inter-Metal Breakdown Voltage Public/Granted day:2017-03-09
Information query
IPC分类:
