Invention Grant
- Patent Title: Image sensor and method for manufacturing same
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Application No.: US14903700Application Date: 2014-07-08
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Publication No.: US09608028B2Publication Date: 2017-03-28
- Inventor: Tae Woo Kim , Dong Jin Lee
- Applicant: Rayence Co., Ltd. , Vatech Ewoo Holdings Co., Ltd.
- Applicant Address: KR Gyeonggi-do KR Gyeonggi-do
- Assignee: Rayence Co., Ltd.,VATECH EWOO Holdings Co., Ltd.
- Current Assignee: Rayence Co., Ltd.,VATECH EWOO Holdings Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do KR Gyeonggi-do
- Agency: IP Legal Services, LLC
- Priority: KR10-2013-0079623 20130708
- International Application: PCT/KR2014/006129 WO 20140708
- International Announcement: WO2015/005660 WO 20150115
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0264 ; H01L31/0296 ; H01L31/0224 ; H01L31/0336

Abstract:
Disclosed is an image sensor, which is characterized by increased strength of adhesion between a photoconductive layer and a front electrode made of aluminum, and which includes a first electrode composed of aluminum, copper or an aluminum-copper alloy on a substrate, a buffer layer formed on the first electrode, a photoconductive layer formed on the buffer layer, and a second electrode formed on the photoconductive layer, wherein the buffer layer includes a material having higher strength of adhesion than the photoconductive layer to the first electrode.
Public/Granted literature
- US20160172415A1 IMAGE SENSOR AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-06-16
Information query
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