Invention Grant
- Patent Title: Solid-state imaging apparatus, method of manufacturing the same, and electronic apparatus
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Application No.: US14338929Application Date: 2014-07-23
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Publication No.: US09608030B2Publication Date: 2017-03-28
- Inventor: Hiroshi Horikoshi
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2013-157934 20130730
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A solid-state imaging apparatus includes an imaging region in which pixels are arranged, a connection region that surrounds the imaging region and includes an electrode pad, and an in-layer lens that is formed in the imaging region for each of the pixels. The in-layer lens is formed of a coating-type high-refractive-index material. The connection region includes an opening that is formed such that an upper surface of the electrode pad is exposed from the high-refractive-index material applied to the electrode pad.
Public/Granted literature
- US20150035104A1 SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2015-02-05
Information query
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