Invention Grant
- Patent Title: Semiconductor device
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Application No.: US14735050Application Date: 2015-06-09
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Publication No.: US09608083B2Publication Date: 2017-03-28
- Inventor: Shirou Ozaki , Masahito Kanamura , Norikazu Nakamura , Toyoo Miyajima , Masayuki Takeda , Keiji Watanabe , Toshihide Kikkawa , Kenji Imanishi , Toshihiro Ohki , Tadahiro Imada
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2010-234961 20101019
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L23/29 ; H01L29/20 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/778 ; H01L21/02

Abstract:
A semiconductor device includes a first semiconductor layer formed over a substrate, a second semiconductor layer formed over the first semiconductor layer, a source electrode and a drain electrode formed over the second semiconductor layer, an insulating film formed over the second semiconductor layer, a gate electrode formed over the insulating film, and a protection film covering the insulating film, the protection film being formed by thermal CVD, thermal ALD, or vacuum vapor deposition.
Public/Granted literature
- US20150279956A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-10-01
Information query
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