Invention Grant
- Patent Title: Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same
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Application No.: US14707671Application Date: 2015-05-08
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Publication No.: US09608188B2Publication Date: 2017-03-28
- Inventor: John Reifenberg , Lindsay Miller , Matthew L. Scullin , Adam Lorimer , Sravan Kumar R. Sura , Sasi Bhushan Beera , Douglas Crane
- Applicant: Alphabet Energy, Inc.
- Applicant Address: US CA Hayward
- Assignee: Alphabet Energy, Inc.
- Current Assignee: Alphabet Energy, Inc.
- Current Assignee Address: US CA Hayward
- Agency: K&L Gates LLP
- Main IPC: H01L35/04
- IPC: H01L35/04 ; H01L35/22 ; H01L35/34

Abstract:
A method includes preparing a thermoelectric material including p-type or n-type material and first and second caps including transition metal(s). A powder precursor of the first cap can be loaded into a sintering die, punches assembled thereto, and a pre-load applied to form a first pre-pressed structure including a first flat surface. A punch can be removed, a powder precursor of the p-type or n-type material loaded onto that surface, the punch assembled to the die, and a second pre-load applied to form a second pre-pressed structure including a second substantially flat surface. The punch can be removed, a powder precursor of the second cap loaded onto that surface, the first punch assembled to the die, and a third pre-load applied to form a third pre-pressed structure. The third pre-pressed structure can be sintered to form the thermoelectric material; the first or second cap can be coupled to an electrical connector.
Public/Granted literature
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