Several embodiments of the present technology are related to network-on-chip based integrated circuits, methods of manufacturing or fabricating such integrated circuits, and electronic/computing devices incorporating such integrated circuits. In one embodiment, a computing device includes a substrate, a plurality of computing nodes interconnected by a plurality of interconnects on the substrate to form a wired network. The individual computing nodes include one or more computing processors. The computing device further includes a pair of wireless transceivers individually connected to one of the computing nodes and spaced apart from each other by a network diameter of the wired network.