- Patent Title: Graphite sheet to redirect SMT components during thermal exposure
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Application No.: US14560807Application Date: 2014-12-04
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Publication No.: US09609738B1Publication Date: 2017-03-28
- Inventor: Dennis Willie , Richard Loi , David Geiger , Anwar Mohammed , Murad Kurwa , Hector Rene Marin Hernandez
- Applicant: Flextronics AP, LLC
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Haverstock & Owens LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K1/11 ; H05K7/20

Abstract:
A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. The formed graphite sheet is shaped to selective direct impinging heat. The heat can be directly away from the entire electronic component. Alternatively, the heat can be selectively directed away from some portions of the electronic component and toward other portions of the electronic component.
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