Invention Grant
- Patent Title: Flux, solder composition, and method for manufacturing electronic circuit mounted substrate
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Application No.: US14384204Application Date: 2013-03-11
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Publication No.: US09609762B2Publication Date: 2017-03-28
- Inventor: Kenji Arai , Mitsuyasu Furusawa , Junichi Aoki , Mayumi Takada , Munehiko Nakatsuma
- Applicant: KOKI Company Limited
- Applicant Address: JP Tokyo
- Assignee: KOKI Company Limited
- Current Assignee: KOKI Company Limited
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Priority: JP2012-054833 20120312
- International Application: PCT/JP2013/056660 WO 20130311
- International Announcement: WO2013/137200 WO 20130919
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K31/02 ; B23K35/34 ; H05K3/34 ; B23K35/36 ; B23K35/362 ; H05K13/04 ; H05K1/03
Abstract:
Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
Public/Granted literature
- US20150102090A1 Flux, Solder Composition, and Method for Manufacturing Electronic Circuit Mounted Substrate Public/Granted day:2015-04-16
Information query
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