An electronic device assembly includes an electronic device having a mount that includes a mounting opening. The mounting opening is configured to receive mounting hardware therein for mounting the electronic device to a structure. An isolator is coupled to the mount. The isolator includes an elastomeric bushing configured to attenuate at least one of shock or vibration exerted on the electronic device. The isolator is incorporated within the mount such that the elastomeric bushing is received into the mounting opening of the mount.