Invention Grant
- Patent Title: Electromagnetic shielding film, flexible printed wiring board with electromagnetic shielding film, electronic device and method for forming the same
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Application No.: US14318962Application Date: 2014-06-30
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Publication No.: US09609793B2Publication Date: 2017-03-28
- Inventor: Toshiyuki Kawaguchi
- Applicant: Shin-Etsu Polymer Co., Ltd.
- Applicant Address: JP
- Assignee: SHIN-ETSU POLYMER CO., LTD.
- Current Assignee: SHIN-ETSU POLYMER CO., LTD.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2013-139991 20130703
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K1/03
Abstract:
A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate.
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