Invention Grant
- Patent Title: Intervertebral implant
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Application No.: US14335251Application Date: 2014-07-18
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Publication No.: US09610174B2Publication Date: 2017-04-04
- Inventor: Wei-Ching Wang , Yen-Nien Chen , Tzyy-Ker Sue , For-Son Wang , Wei-Jen Shih , Wei-Te Chen
- Applicant: METAL INDUSTRIES RESEARCH&DEVELOPMENT CENTRE
- Applicant Address: TW Kaohsiung
- Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
- Current Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
- Current Assignee Address: TW Kaohsiung
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW102143685A 20131129
- Main IPC: A61F2/44
- IPC: A61F2/44 ; B22F3/11 ; B22F7/06 ; C22C1/04 ; A61L27/04 ; A61L27/56 ; B22F3/10 ; B22F5/00 ; A61F2/30
Abstract:
An intervertebral implant is a porous structure formed of a plurality of metal balls, and the intervertebral implant includes a bone support area and a bone growth area. The bone support area and the bone growth area each have a plurality of connecting holes, and a porosity of the bone support area is smaller than that of the bone growth area.
Public/Granted literature
- US20150150689A1 INTERVERTEBRAL IMPLANT Public/Granted day:2015-06-04
Information query
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