Invention Grant
- Patent Title: Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication
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Application No.: US14674138Application Date: 2015-03-31
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Publication No.: US09610615B2Publication Date: 2017-04-04
- Inventor: Chia-Ying Tien , Chia-Lin Hsueh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: B08B1/04
- IPC: B08B1/04 ; B08B1/00 ; H01L21/02 ; H01L21/67 ; B08B3/12
Abstract:
A method for cleaning a semiconductor wafer after a Chemical Mechanical Polishing (CMP) process is provided. The method includes providing the semiconductor wafer into a cleaning module. The method further includes cleaning the semiconductor wafer by rotating a cleaning brush assembly. The method also includes applying an agitated cleaning liquid to clean the cleaning brush assembly.
Public/Granted literature
- US20160293402A1 METHOD AND SYSTEM FOR CLEANSING WAFER IN CMP PROCESS OF SEMICONDUCTOR MANUFACTURING FABRICATION Public/Granted day:2016-10-06
Information query
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