Invention Grant
- Patent Title: Desoldering tool and control system
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Application No.: US14943977Application Date: 2015-11-17
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Publication No.: US09610645B2Publication Date: 2017-04-04
- Inventor: Toshikazu Mochizuki , Hitoshi Takeuchi , Tetsuo Yokoyama
- Applicant: Hakko Corporation
- Applicant Address: JP Osaka
- Assignee: Hakko Corporation
- Current Assignee: Hakko Corporation
- Current Assignee Address: JP Osaka
- Agent David B. Abel
- Main IPC: B23K1/018
- IPC: B23K1/018 ; B23K3/02 ; B23K3/08 ; B23K1/00 ; B23K3/03 ; B23K101/42
Abstract:
A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.
Public/Granted literature
- US20160175959A1 Desoldering Tool and Control System Public/Granted day:2016-06-23
Information query
IPC分类:
