Invention Grant
- Patent Title: Solder paste
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Application No.: US14272127Application Date: 2014-05-07
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Publication No.: US09610655B2Publication Date: 2017-04-04
- Inventor: Deok Ki Hwang
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2013-0053047 20130510
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B22F1/02 ; B23K35/26 ; B23K35/30 ; B23K35/36 ; B23K35/24 ; B23K1/00 ; H05K3/34 ; H01L23/00 ; B22F1/00 ; B23K35/00 ; C22C1/04
Abstract:
A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one metal dissolved in the tin (Sn), and the second powder may be a copper (Cu) powder, the surface of which is coated with silver (Ag).
Public/Granted literature
- US20140332116A1 SOLDER PASTE Public/Granted day:2014-11-13
Information query
