Invention Grant
- Patent Title: Tire mounting method using a tire mounting device
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Application No.: US14295251Application Date: 2014-06-03
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Publication No.: US09610660B2Publication Date: 2017-04-04
- Inventor: Saeko Komatsu , Yoshito Otake
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2008-019126 20080130; JP2008-019131 20080130; JP2008-022395 20080201; JP2008-174717 20080703; JP2008-174722 20080703; JP2008-174726 20080703
- Main IPC: B23P19/00
- IPC: B23P19/00 ; B23P19/04 ; B23P19/06 ; B25J15/10 ; B62D65/12 ; B23P21/00 ; B62D65/02

Abstract:
A tire mounting method for automatically mounting tires onto hub bolts of a motor vehicle using a tire mounting device having a first working mechanism and a second working mechanism. The method includes feeding the motor vehicle intermittently so that hub bolts of a front wheel and hub bolts of a rear wheel are successively positioned in a tire mounting station. Tires are gripped by a tire gripping unit of the first working mechanism, and nuts are successively temporarily tightened onto hub bolts of front and rear wheels to which the tires are mounted. The nuts, which have been temporarily tightened, are then fully tightened using the second working mechanism.
Public/Granted literature
- US20140331467A1 TIRE MOUNTING METHOD Public/Granted day:2014-11-13
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