Invention Grant
- Patent Title: Connector housing
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Application No.: US14454037Application Date: 2014-08-07
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Publication No.: US09610716B2Publication Date: 2017-04-04
- Inventor: Atsushi Kagawa
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Mots Law, PLLC
- Priority: JP2010-261565 20101124
- Main IPC: B29C45/00
- IPC: B29C45/00 ; C08J5/04 ; C08K7/14 ; C08K3/40 ; B29K67/00 ; B29K105/12 ; B29K309/08 ; B29L31/30 ; B29L31/34
Abstract:
A connector housing (1) is molded by using a resin material essentially containing a polybutylene terephthalate reinforced with fibers, the polybutylene terephthalate having properties with a flexural modulus of 5000 to 7000 MPa as measured by ASTM D790 and a bar flow length of 80 to 130 mm.
Public/Granted literature
- US20140346708A1 CONNECTOR HOUSING Public/Granted day:2014-11-27
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