Invention Grant
- Patent Title: Lamination molding apparatus
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Application No.: US14887348Application Date: 2015-10-20
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Publication No.: US09610732B2Publication Date: 2017-04-04
- Inventor: Katsuhiko Kobayashi , Ichiro Araie
- Applicant: SODICK CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: SODICK CO., LTD.
- Current Assignee: SODICK CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Jianq Chyun IP Office
- Priority: JP2014-214399 20141021
- Main IPC: B29C35/08
- IPC: B29C35/08 ; B29C67/00 ; B28B1/16 ; B28B17/00 ; B22F3/105 ; B33Y30/00 ; B33Y10/00

Abstract:
A lamination molding apparatus 10 includes a powder layer forming apparatus 20, a recoating head 30, a servo motor 16, a laser irradiating device 40, a numerical control apparatus 52, a laser control apparatus 54 and a computer aided manufacturing (CAM) system 56. The blade 31 moves in the horizontal axis direction so as to form the powder layer on a predetermined molding region. The laser control apparatus 54 controls the laser irradiating device 40 and calculates an irradiation range of a laser beam for every powder layer. The numerical control apparatus 52 obtains data of the irradiation range from the laser irradiating device 40 and outputs a move command such that the blade 31 moves at a feed speed faster than a pre-set feed speed adapted for recoating, in the molding region outside of the irradiation range.
Public/Granted literature
- US20160107233A1 LAMINATION MOLDING APPARATUS Public/Granted day:2016-04-21
Information query
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