Invention Grant
- Patent Title: Adhesive bond using different adhesives
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Application No.: US14449584Application Date: 2014-08-01
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Publication No.: US09610757B2Publication Date: 2017-04-04
- Inventor: Jurgen Lorenz , Helga Garmann , Hermann Weidmann , Matthias Baust
- Applicant: Henkel AG & Co. KGaA
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Priority: DE102012201780 20120207
- Main IPC: B21B21/00
- IPC: B21B21/00 ; B32B37/12 ; B27N7/00 ; C09J5/02 ; C09J5/08 ; B32B21/04 ; B32B37/06 ; C09J175/04

Abstract:
A method for adhesively bonding shaped elements made from wood-based materials to flexible film substrates, in which i) the side that is to be bonded is mechanically processed, ii) a reactive one- or two-component polyurethane adhesive is applied to the center regions of this side, iii) an aqueous adhesive based on EVA, PVAc, PVOH is applied at least to the outer region of this side, and iv) this side is bonded to a flexible substrate as an edge coating.
Public/Granted literature
- US20140342135A1 ADHESIVE BOND USING DIFFERENT ADHESIVES Public/Granted day:2014-11-20
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