A method for making an interconnect structure includes applying a first metal layer to an electronic device, wherein the electronic device comprises at least one I/O contact and the first metal layer is located on a surface of the I/O contact; applying a removable layer to the electronic device. The removable layer is adjacent to the first metal layer. An adhesive layer is applied to the electronic device or to a base insulative layer. The electronic device is secured to the base insulative layer using the adhesive layer. The first metal layer and removable layer are disposed between the electronic device and the base insulative layer.