Invention Grant
- Patent Title: Method for producing liquid-ejection-head substrate and liquid-ejection-head substrate produced by the same
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Application No.: US15013780Application Date: 2016-02-02
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Publication No.: US09610773B2Publication Date: 2017-04-04
- Inventor: Satoshi Ibe , Keiji Watanabe , Junya Hayasaka , Shiro Sujaku , Kouji Hasegawa
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A. Inc., IP Division
- Priority: JP2015-021653 20150205
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; H05K3/36
Abstract:
A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.
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