Invention Grant
- Patent Title: Formaldehyde free electroless copper plating compositions and methods
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Application No.: US13769332Application Date: 2013-02-17
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Publication No.: US09611550B2Publication Date: 2017-04-04
- Inventor: Andy Lok-Fung Chow , Dennis Kwok-Wai Yee , Crystal P. L. Li
- Applicant: Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Main IPC: H01B1/02
- IPC: H01B1/02 ; C23C18/40 ; C09D1/00 ; H05K3/18
Abstract:
The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
Public/Granted literature
- US20140178572A1 FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS Public/Granted day:2014-06-26
Information query
