Invention Grant
- Patent Title: Heat transferring electronics chassis
-
Application No.: US14574362Application Date: 2014-12-17
-
Publication No.: US09611723B2Publication Date: 2017-04-04
- Inventor: Gocha Chochua , Muralidhar Seshadri , Ke Ken Li , Christopher Aumaugher , Melvin Bryan
- Applicant: Schlumberger Technology Corporation
- Applicant Address: US TX Sugar Land
- Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
- Current Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
- Current Assignee Address: US TX Sugar Land
- Agent Michael Dae
- Main IPC: H05K7/20
- IPC: H05K7/20 ; E21B41/00 ; E21B47/01

Abstract:
An apparatus comprising a housing, a chassis, and a plurality of heat-generating components. The chassis is biased into contact with a plurality of locations along an inner surface of the housing in response to elastic deformation of the chassis. The chassis includes a plurality of substantially planar surfaces each interposing ones of the plurality of locations. The plurality of heat-generating components are directly coupled to corresponding ones of the plurality of substantially planar surfaces.
Public/Granted literature
- US20160183404A1 Heat Transferring Electronics Chassis Public/Granted day:2016-06-23
Information query