Invention Grant
- Patent Title: Wafer holder with varying surface property
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Application No.: US13428749Application Date: 2012-03-23
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Publication No.: US09612056B2Publication Date: 2017-04-04
- Inventor: Yi-Hung Lin , Li-Ting Wang , Tze-Liang Lee
- Applicant: Yi-Hung Lin , Li-Ting Wang , Tze-Liang Lee
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: F27D5/00
- IPC: F27D5/00 ; F27B17/00 ; H01L21/67 ; H01L21/687
Abstract:
An apparatus, a system and a method are disclosed. An exemplary apparatus includes a first portion configured to hold an overlying wafer. The first portion includes a central region and an edge region circumscribing the central region. The first portion further including an upper surface and a lower surface. The apparatus further includes a second portion extending beyond an outer radius of the wafer. The second portion including an upper surface and a lower surface. The lower surface of the first portion in the central region has a first reflective characteristic. The lower surface of the first portion in the edge region and the second portion have a second reflective characteristic.
Public/Granted literature
- US20130252189A1 Wafer Holder With Varying Surface Property Public/Granted day:2013-09-26
Information query
