Invention Grant
- Patent Title: Shielding for an electronic circuit
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Application No.: US13866795Application Date: 2013-04-19
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Publication No.: US09612305B2Publication Date: 2017-04-04
- Inventor: Sebastian Martius , Oliver Schwender , Benjamin Sewiolo
- Applicant: Sebastian Martius , Oliver Schwender , Benjamin Sewiolo
- Applicant Address: DE München
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE München
- Agency: Lempia Summerfield Katz LLC
- Priority: DE102012206549 20120420
- Main IPC: G01V3/00
- IPC: G01V3/00 ; G01R33/42 ; H05K9/00 ; G01R33/422

Abstract:
Shielding for an electronic circuit includes at least one substrate. A metal structure is disposed on at least one side of the at least one substrate. The metal structure includes a number of non-contiguous part areas. Adjacent part areas that are disposed on a same side of the substrate are spaced apart from one another by a boundary line running in a serpentine shape.
Public/Granted literature
- US20130278268A1 Shielding for an Electronic Circuit Public/Granted day:2013-10-24
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