Invention Grant
- Patent Title: Hermetic sealing of optical module
-
Application No.: US10663242Application Date: 2003-09-15
-
Publication No.: US09612409B2Publication Date: 2017-04-04
- Inventor: Marc A. Finot , Rickie C. Lake
- Applicant: Marc A. Finot , Rickie C. Lake
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
A hermetically sealable package may be formed from a top portion and a bottom portion mated along a seam at or near a plane of an optical fiber. A completed pill assembly may be positioned directly into the enclosure base without requiring the fiber to be threaded through the feed through or “snout”. The top potion may then be mated with the bottom portion to form the package. A glass solder ring may be placed coaxial with the fiber in the feed through. The seam may be sealed by laser welding and the glass solder ring reflowed by laser heating, for example, with a same laser as used to weld the seam or by resistive or induction heating.
Public/Granted literature
- US20050058411A1 Hermetic sealing of optical module Public/Granted day:2005-03-17
Information query