Invention Grant
- Patent Title: Photomask and method for fabricating integrated circuit
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Application No.: US14471880Application Date: 2014-08-28
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Publication No.: US09612526B2Publication Date: 2017-04-04
- Inventor: Chun-Yu Lin , Yi-Jie Chen , Feng-Yuan Chiu , Ying-Chou Cheng , Kuei-Liang Lu , Ya-Hui Chang , Ru-Gun Liu , Tsai-Sheng Gau
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G03F1/42
- IPC: G03F1/42 ; G03F1/36 ; G06F17/50

Abstract:
A photomask and method for fabricating an integrated circuit is provided. The photomask includes a plurality of main features, enclosed in at least one first region and at least one second region, wherein the first region comprises single the main feature and the second region comprises multiple the main features; and a plurality of assistant features disposed between the first region and the second region, or between the second regions. The photomask enhances the accuracy of the critical dimension and facilitate fabricating an integrated circuit.
Public/Granted literature
- US20160062226A1 PHOTOMASK AND METHOD FOR FABRICATING INTEGRATED CIRCUIT Public/Granted day:2016-03-03
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