- Patent Title: Pattern forming method, electron beam- or extreme ultraviolet-sensitive resin composition, resist film using the same, method of manufacturing electronic device, and electronic device
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Application No.: US14838326Application Date: 2015-08-27
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Publication No.: US09612535B2Publication Date: 2017-04-04
- Inventor: Shuji Hirano , Hiroo Takizawa
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Jianq Chyun IP Office
- Priority: JP2013-039705 20130228
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F7/32 ; G03F7/039 ; G03F7/038 ; G03F7/004 ; G03F7/075 ; G03F7/11 ; C08F12/24 ; C08F20/30 ; C08F20/58
Abstract:
According to one aspect of the present invention, there is provided a pattern forming method comprising, in this order: (1) forming a film by using an electron beam- or extreme ultraviolet-sensitive resin composition containing, in a specific amount, a resin (Aa) having a specific atom or substituent; (2) exposing the film by using an electron beam or extreme ultraviolet ray; and (3) forming a negative pattern by performing development using a developer including an organic solvent after the exposure.
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