Invention Grant
- Patent Title: Method for determining a machining means in hybrid ultraprecision machining device, and hybrid ultraprecision machining device
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Application No.: US14343428Application Date: 2012-12-14
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Publication No.: US09612594B2Publication Date: 2017-04-04
- Inventor: Takashi Shindo , Yoshiyuki Uchinono , Kimitake Okugawa , Noboru Urata , Syoji Kuroki , Akira Fukuoka , Atsushi Sakaguchi
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-273089 20111214
- International Application: PCT/JP2012/083174 WO 20121214
- International Announcement: WO2013/089282 WO 20130620
- Main IPC: B23K26/0622
- IPC: B23K26/0622 ; G05B19/18 ; B23P23/04 ; B23K26/08 ; G05B19/401 ; B23Q39/02

Abstract:
There is provided a method for determining a machining means in a hybrid ultraprecision machining device for manufacturing a micro-machined product from a workpiece, the machining device comprising: an electromagnetic-wave-machining means for roughly machining the workpiece; a precision-machining means for precisely machining the roughly machined workpiece; and a shape-measurement means for measuring a shape of the workpiece upon use of the electromagnetic-wave machining means and the precision-machining means, wherein a choice is made between the electromagnetic-wave-machining means and the precision-machining means in the determination of the machining means, on the basis of: information on a stereoscopic model of the micro-machined product; information on a removal volume to be removed from a volume of the workpiece in the manufacturing of the micro-machined product; and data on a removal process time of the electromagnetic-wave-machining means and data on a removal process time of the precision-machining means.
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Information query
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