Invention Grant
- Patent Title: Top mount clickpad module
-
Application No.: US14588041Application Date: 2014-12-31
-
Publication No.: US09612703B2Publication Date: 2017-04-04
- Inventor: Yeh-Cheng Tan , Chia-Ling Hung
- Applicant: SYNAPTICS INCORPORATED
- Applicant Address: US CA San Jose
- Assignee: Synaptics Incorporated
- Current Assignee: Synaptics Incorporated
- Current Assignee Address: US CA San Jose
- Agency: Osha Liang LLP
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044 ; G06F3/047

Abstract:
An input device for use with an electronic system of the type including a substantially planar deck having a basin extending downwardly from the deck and comprising at least one slot. The input device includes: a downwardly deflectable component including an input surface configured to be touched by input objects and a capacitive sensor layer configured to sense positional information of the input objects; a hinge having a first hinged component comprising at least one pad coupled to a bottom surface of the deflectable component, a second hinged component configured to be secured to the basin, and at least one tab configured to be inserted into the at least one slot; and an actuation element disposed between the first and second hinged components and configured to detect deflection of the deflectable component in response to force applied to the input surface by an input object.
Public/Granted literature
- US20160188048A1 TOP MOUNT CLICKPAD MODULE Public/Granted day:2016-06-30
Information query