Invention Grant
- Patent Title: Finger sensor including encapsulating layer over sensing area and related methods
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Application No.: US14226238Application Date: 2014-03-26
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Publication No.: US09613249B2Publication Date: 2017-04-04
- Inventor: Matthew M. Salatino , Anthony Iantosca
- Applicant: APPLE INC.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: G06K9/20
- IPC: G06K9/20 ; G06K9/00 ; H01L23/31 ; H01L23/00
Abstract:
A fingerprint sensor may include a substrate, and a finger sensing IC on the substrate and including a finger sensing area on an upper surface thereof for sensing an adjacent finger. The fingerprint sensor may include an encapsulating material on the finger sensing IC and covering the finger sensing area, and a bezel adjacent the finger sensing area and on an uppermost surface of the encapsulating layer.
Public/Granted literature
- US20140205161A1 FINGER SENSOR INCLUDING ENCAPSULATING LAYER OVER SENSING AREA AND RELATED METHODS Public/Granted day:2014-07-24
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