In certain embodiments of radio frequency identification (RFID) operational capability removal, different stages of a life cycle of an RFID integrated circuit (IC) are supported. In one stage, an RFID IC is coupled to an RFID antenna and uses the RFID antenna to communicate wirelessly. In another stage, an operational capability of the RFID IC is removed by coupling a component thereto. For example, a circuit board includes an RFID IC and an RFID antenna operably coupled thereto. During a manufacturing stage of a device, the RFID IC can communicate using the RFID antenna. As part of the device assembly, a device component is mated to the circuit board. Respective electrical connection parts of the circuit board and of the device component are coupled together as part of a mating procedure. The coupling removes an operational capability of the RFID IC, such as a capability to use the RFID antenna.