Invention Grant
- Patent Title: Method using epitaxial transfer to integrate HAMR photonic integrated circuit (PIC) into recording head wafer
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Application No.: US14804004Application Date: 2015-07-20
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Publication No.: US09613647B2Publication Date: 2017-04-04
- Inventor: Thomas Dudley Boone, Jr.
- Applicant: HGST Netherlands B.V.
- Applicant Address: US CA Irvine
- Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee Address: US CA Irvine
- Agency: Patterson & Sheridan, LLP
- Main IPC: G11B5/84
- IPC: G11B5/84 ; G11B5/31 ; G11B5/60 ; G11B5/00

Abstract:
Embodiments of the present invention generally relate to a method for forming a HAMR device having a photonic integrated circuit that includes an optical detector, an optical emitter, and an optical element distinct from the optical detector and the optical emitter, where the elements of the photonic integrated circuit are aligned with a near field transducer. The method includes forming one or more layers on a substrate, bonding the layers to a partially fabricated recording head, removing the substrate using epitaxial lift-off, and forming the optical elements on the partially fabricated recording head.
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