Invention Grant
- Patent Title: Integration of absorption based heating bake methods into a photolithography track system
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Application No.: US14858568Application Date: 2015-09-18
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Publication No.: US09613801B2Publication Date: 2017-04-04
- Inventor: Michael A. Carcasi , Mark H. Somervell , Benjamen M. Rathsack
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Wood Herron & Evans LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/02 ; H01L21/027 ; B81C1/00 ; G03F7/00 ; H01L21/268 ; H01L21/28 ; H01L21/66
Abstract:
A method of patterning a layered substrate is provided that includes forming a layer of a block copolymer on a substrate, annealing the layer of the block copolymer to affect microphase segregation such that self-assembled domains are formed, and annealing the layer of the block copolymer a second time to refine or modify the microphase segregation, where one of the annealing steps uses an absorption based heating method.
Public/Granted literature
- US20160013052A1 INTEGRATION OF ABSORPTION BASED HEATING BAKE METHODS INTO A PHOTOLITHOGRAPHY TRACK SYSTEM Public/Granted day:2016-01-14
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