Invention Grant
- Patent Title: Substrate processing apparatus and maintenance method thereof
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Application No.: US14395584Application Date: 2013-04-01
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Publication No.: US09613837B2Publication Date: 2017-04-04
- Inventor: Shigeru Senzaki , Michishige Saito , Daiki Satoh , Ken Horiuchi , Koji Ando , Shingo Koiwa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2012-098791 20120424
- International Application: PCT/JP2013/059981 WO 20130401
- International Announcement: WO2013/161519 WO 20131031
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01J37/32 ; B25J11/00

Abstract:
A substrate processing apparatus includes: a first processing chamber; a second processing chamber; a transfer chamber; a frame structure; and an elevating part. Each of the first and the second processing chamber has a main body part and a lid part. The transfer chamber is connected to the first and the second processing chamber and accommodates a transfer unit for transferring the substrate. The frame structure has a pair of column parts and a beam part supported at top portions of the column parts. The elevating part is coupled to the beam part to be moved in a horizontal direction and moves the lid part in the vertical direction. The beam part extends above the first and the second processing chamber and the transfer chamber.
Public/Granted literature
- US20150086302A1 SUBSTRATE PROCESSING APPARATUS AND MAINTENANCE METHOD THEREOF Public/Granted day:2015-03-26
Information query
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