Invention Grant
- Patent Title: Apparatus and method for bonding substrates
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Application No.: US14238091Application Date: 2011-08-22
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Publication No.: US09613840B2Publication Date: 2017-04-04
- Inventor: Thomas Wagenleitner
- Applicant: Thomas Wagenleitner
- Applicant Address: AT
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT
- Agency: Kusner & Jaffe
- Priority: EPPCT/EP2011/063968 20110812
- International Application: PCT/EP2011/064353 WO 20110822
- International Announcement: WO2013/023708 WO 20130221
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/683 ; H01L21/67
Abstract:
This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface. The mounting apparatus has an outer ring section for controllable fixing of the first substrate. Deformation means are provided for controllable deformation of the first substrate. The deformation means act within the outer ring section. Bonding means are provided for bonding of the first substrate with the second substrate.
Public/Granted literature
- US20140209230A1 APPARATUS AND METHOD FOR BONDING SUBSTRATES Public/Granted day:2014-07-31
Information query
IPC分类:
