Invention Grant
- Patent Title: Damascene wires with top via structures
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Application No.: US14818419Application Date: 2015-08-05
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Publication No.: US09613861B2Publication Date: 2017-04-04
- Inventor: Brent A. Anderson , Edward J. Nowak
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent David Cain; Andrew M. Calderon
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/522 ; H01L23/532 ; H01L23/528
Abstract:
Damascene wires with top via structures and methods of manufacture are provided. The semiconductor structure includes a damascene wiring structure with an integrally formed top via structure in self-alignment with the damascene wiring structure which is underneath the integrally formed top via structure.
Public/Granted literature
- US20170040216A1 DAMASCENE WIRES WITH TOP VIA STRUCTURES Public/Granted day:2017-02-09
Information query
IPC分类:
